Events – Visiorobotics

EVENTS

Meet us and our partners at:

EPFL

EPFL: Micro and nano fabrication annual review meeting: Presenting research achievements of the past year and interaction among professors, researchers and industry partners

IMAPS

Imaps Italy & Pack4EU workshop: advanced technology for microelectronic sensor packaging

WOLTE 16

WOLTE is a biennial conference devoted to the presentation and exchange of the most recent advances in low temperature electronics (LTE) and applications.

MINAPAD

MiNaPAD is a 2 days conference with an exhibition. The objective of this event is to reinforce the design community (which constitutes the largest share of the semiconductor community in Europe) and the assembly and packaging community

LETI DAYS

LETI INNOVATION DAYS: fast track from LAB TO FAB EVENT: putting innovative technologies into production

ESTC

The 10th IEEE Electronics System-Integration Technology Conference (IEEE ESTC 2024) is the premier international event in the field of electronics packaging and system integration.

ECOC

The European Conference on Optical Communication (ECOC) is Europe’s leading conference on optical communications, and one of the largest and most prestigious events in the ﬁeld worldwide. The conference brings together experts and leaders from academia, research and industry across the globe to share their latest breakthroughs and visions for the future.

ESREF

This International Symposium will continue its 35-year history of focusing on the latest research developments and future directions in failure analysis, quality and reliability of materials, devices and circuits for microelectronics and optoelectronics, power, space, and automotive electronics. It historically provides an European forum to develop all aspects of reliability, including management and advanced failure analysis techniques for present and emerging semiconductor applications.

SEMICON

SEMICON Europa 2024 is co-located with electronica in Munich, Germany creating the strongest single event for electronics manufacturing in Europe, and broadening the range of attendees across the electronics chain.

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